Home > Products > PCB Board Assembly > OEM Electronic Pcb Board Assembly With Smt Dip Technology, Control Board Pcb Assembly Service
OEM Electronic Pcb Board Assembly With Smt Dip Technology, Control Board Pcb Assembly Service
- 0 Piece / Pieces per Month
- T/T L/C D/P D/A
- 7 days
Product Details
Brand Name: | Fortunemount | Place of Origin: | China |
Product Description
Certification:RoHS, CE, FCC
OEM Electronic Pcb Board Assembly With Smt Dip Technology, Control Board Pcb Assembly Service
Our capabilities for handling the Bare PC Board fabrication
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)
Our services for the PCB Assembly
Re-layout for shortening the board size Bare pc board fabrication SMT/BGA/DIP assembly Full component procurement or the substitute components sourcing Wire harness and cable assembly Metal parts, rubber parts and plastic parts including mold making Mechanical, case and rubber molding assembly Functional testing Repairs and inspection of the sub-finished / finished goodsOur capabilities for the PCB Assembly
Stencil Size Range |
736 mm x 736 mm |
Min. IC Pitch |
0.30 mm |
Max. PCB Size |
410 mm x 360 mm |
Min. PCB Thickness |
0.35 mm |
Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
Max. BGA Size |
74 mm X 74 mm |
BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
BGA Ball Diameter |
0.40 mm (Min) /F1.00 mm (Max) |
QFP Lead Pitch |
0.38 mm (Min) /F2.54 mm (Max) |
Frequency of Stencil Cleaning |
1 time / 5 ~ 10 Pieces |
Our manufacturing experience includes, but is not limited to:
Note Book fields |
CHARGER BOARD |
INVERTER |
POWER CPU |
LVDS CARD |
IR BOARD |
LCD MOTHERBOARD |
LED BOARD |
RAM CARD |
DATA BOARD |
BATT BOARD |
|
DVR MOTHERBOARD |
USB BOARD |
CARD READER |
AUDIO BOARD |
ISDN MODEN |
|
PC fields |
2.5 inch HDD |
PC/MAC FDD |
DOCKING |
PORT REPILICATOR |
PCMCIA CARD |
3.5 inch HDD |
Contact Us
- Fortune Mount International Ltd
- Contact nameKen PAN
- Phone86-755-33100752
- Address3rd floor,Building 2,Jianghao Technology Zone, No. 438 Jihua Road, Bantian town , Longgng District Dezhou,Shandong
BGA Assembly | DIP Assembly | Electronic PCB Assembly | Multilayer PCB Board |
PCB Board Assembly | Printed Circuit Board Assembly | SMT PCB Assembly |
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