Tungsten Copper Plate

Tungsten copper plate combines theadvantages of tungsten and copper, in which a high melting point of tungsten(tungsten melting point of 3410 ℃, iron melting point 1534 ℃), high density (tungsten density of 19.34g / cm3, iron density 7.8g/ cm3); excellent thermal conductivity properties of copper, tungsten copperplate (component generally ranges WCu7 ~ WCu50) with uniform microstructure,high temperature, high strength, resistance to arc erosion, high density;moderate conductivity and thermal conductivity, are widely used in militaryhigh temperature materials, high pressure switching electrical alloy, EDMelectrode, microelectronic materials, parts and components as widely used inaerospace, aviation, electronics, electricity, metallurgy, machinery, sportsequipment and other industries.