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4-layer Phone Mother Board With Immersion Gold and 10z Copper Thickness

4-layer Phone Mother Board With Immersion Gold and 10z Copper Thickness photo-1
Negotiable MOQ: 10 Kilograms (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
3C-TECHNOLOGY
Place of Origin:
China
Model Number:
3C-MHDI-25
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Brand Name 3C-TECHNOLOGY
Place of Origin China
Model Number 3C-MHDI-25
  • Material: FR4
  • Layers: 4
  • Copper thickness: 1oz
  • Solder mask: green
  • Silkscreen: white
  • Surface finish: immersion silver
  • Board size: 80 x 76mm
  • Board finished thickness: 0.21 to 7.0mm
  • Maximum finished board size: 23 x 25mm (580 x 900mm)
  • Minimum drilled hole size: 3mil (0.075mm)
  • Minimum line width: 3mil (0.075mm)
  • Minimum line spacing: 3mil (0.075mm)
  • Copper thickness in hole: >25.0cm (>1mil)
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Shape tolerance: ±0.13
  • Applications: gas detectors, remote controls, telecommunication products

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Business Type
Trading Company
Year Established
1998
Total Employees
101 - 200 People
Main Markets
North America, South America, Eastern Europe

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