United States Conductive Offset Ink

Specifications: High speed, silver nano ink for printed electronics on dry offset presses for printing conductive lines 500 nanometer to 2 microns thick Product description: Silver nanopowder suspended in an aqueous medium formulated with rheology modifiers and adhesion promoters for use as an ink system in printing very fine lines with high conductivity using dry offset printing. Processing guidelines: Application methods: Dry offset printing Substrates: Includes, but not limited to: Polyester, polyethylene, Liquid crystal polymer (lcp), polypropylene, and paper. Oven treatment: In a forced air convection oven, 1 to 3 minute @ 100c 30 to 90 seconds @ 125c These times are meant as a processing guide and represent the cure time for the poi silver ink as supplied. Times may vary with airflow velocity, wet trace thickness, larger particle inclusion, and modification of the as supplied aqueous solvent system. Times in static ovens are generally longer. Particle size nominal size 15 nm Size range 2 nm to 400 nm Concentration The metal particle concentration is available in the range 40 wt% up to 60 wt% Electrical conductivity The weight resistivity of films prepared from pfi200, cured at 130oc for 90 seconds has been measured to be 5 to 10x that of bulk silver (0.15 g/ohms/m2) Adhesion Adhesion is measured by a 90 degree aggressive tape test. The adhesion of the films to print treated pet is excellent. Adhesion to untreated pet depends on the thickness of the substrate; thinner substrates (2mil) are more difficult to adhere to.