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RA Copper Foil
Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material.
Base Material:C11000 Copper, Cu > 99.90%
Thickness Range:0.0004inch~0.006inch (0.01mm-0.15mm)
Width Range:0.16inch~16inch (4mm-400mm)
Temper: Hard, Quarter Hard, Half Hard, Soft
Application: Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decoration etc.
GB | ALLOY NO. |
| SIZE(mm) | |||
(ISO) | (ASMT) | (JIS) | (BIS) | (DIN) | ||
T2 | Cu-ETP | C11000 | C1100 | C101 | R-Cu57 | Thickness:0.01-0.15 Max Width: 400 |
TU2 | Cu-OF | C10200 | C1020 | Cu-OF C | OF-Cu | |
Mechanical Properties
Temper | JIS Temper | Tensile strength Rm/N/mm2 | Elogantion A50/% | Hardness HV |
M | O | 220~275 | ≥ 15 | 50~70 |
Y4 | 1/4H | 240~300 | ≥ 9 | 65~85 |
Y | H | 330~450 | --- | 100~140 |
T | EH | 380~510 | --- | --- |
Note: We can provide products with other properties according to customers` requirements.
Physical Properties
Density: 8.9g/cm3
Electrical conductivity (20°C): min 90%IACS for annealed to temper
min 80%IACS for rolled to temper
Thermal conductivity (20°C): 390W/(m°C)
Elastic modulus: 118000N/m
Softening temperature: ≥380°C
Sizes and Tolerances (mm)
Thickness | Thickness Tolerance | Width | Width Tolerance |
0.01~0.015 | ± 0.002 | 4~250 | ± 0.1 |
> 0.018~0.10 | ± 0.003 | 4~400 | |
> 0.10~0.15 | ± 0.005 | 4~400 |
Specifications Available (mm)
Thickness | Width | Temper |
0.01~0.015 | 4~250 | O,H |
0.018~0.10 | 4~400 | O,H |
0.10~0.15 | 4~400 | O,1/4H,1/2H,H |
Carried Standard(Latest)
Nations | Standard No. | Standard Name |
China | GB/T2059--2000 | CHINA’S NATIONAL STANDARD |
Japan | JIS H3100 :2000 | COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS |
U.S.A | ASTM B36/B 36M -01 | STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR |
Germany | DIN-EN 1652:1997 | COPPER AND COPPER ALLOYS PLATE,SHEET,STRIP AND CIRCLES FOR GENERAL PURPOSES |
DIN-EN 1758 :1997 | COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES | |
SEMI | SEMI G4-0302 | SPECIFICATION FOR INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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