RW-SV520 Mobile Phone Repairing and Soldering Stations

RW-SV520 Easy operating Manual bga chip rework station for xbox360 repair

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1. Independent 3 Temperature Zone:

1) Top hot air heater

2) Bottom hot air heater 

3) Bottom IR preheat - Prevent PCB board deforming

2. Color LCD Display Optical Alignment:

1) Split vision

2) Zoom in/out and micro-adjust

3) Equipped with aberration

4) Detection device

5) With auto focus and software operation function

3. Anti Warpage&Deformation Support

Specially designed with flexibly-moving clamping device to clamp all kinds of PCB,

also equipped with particular clamps for laptop motherboard

Special anti- warpage design ,the support pillars can be adjusted up & down to

support the board to prevent the PCBA from sinking while heating

4. PLC Control:

SV-520 use PLC control, real-time temperature curve display,

able to display temperature curves and practical curves as the same time:

can analyze the practically-tested profile, and compare them with the history saved profiles; 

5. Operation Menu  

1.Able to arrive at three independent temperature zones, temperature and time can

be displayed digitally on the touch screen

2.8 segments of temperature up (down) and 8 segments constant temperature control,

more than 50000 groups of profile can be stored. 

6. Real-time Temperature Analysis and Store 

1.It is able to display 1 practically-tested temperature curve at the same time,

2.auto-calculate the preheat time, reflow time and max temp, so to control temp. of every point of BGA overall; can create profile for every kind of BGA accordingly.