Popular BGA Rework Station for Computer(RW-E6000)

Specifications

Popular BGA Rework Station for computer(RW-E6000)

Specification

-----------------------------------------------------------------------------------------------------------------------------

 Description

•  Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
• Color optical system with functions of split vision, zoom - in and micro adjustment,equipped  with aberration detection device; with auto focus and software operation function,22X optical zoom; able to rework BGA sized up to 70mm×70mm;
• Touch screen interface, PLC control; real-time profile display;able to display set profile and measured profile at the same time;
• Color LCD monitor;
•  Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
• 8 segments of temperature up (down) and 8 segments constant temperature control, 200  groups profiles can be stored; profile analysis can be carried out on the touch  screen ;
• Able to arrive at three independent heating areas,temperature and time can be displayed digitally on the touch screen;able to rework CGA;
• The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
• Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
• Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different positions on PCB;
•  Finish the BGA rework process under the nitrogen protection, have special function of nitrogen-saving;
• Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle.
• Driven by the servo motor,the integrative hot air head can store 20 groups of different BGA heating points and register marks.
• Can rework all types of CSP, BGA, CGA;  handle 775 socket, 478 socket, XBOX360, PS2/3 etc.