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Home > Manufacturing & Processing Machinery > Manufacturing Equipment for Electrical & Electronic Product > Chip Mounter > SV550A Laptop Motherboard Bga Reballing Tool With Two Cameras and Auto-placement Function
SV550A Laptop Motherboard Bga Reballing Tool With Two Cameras and Auto-placement Function
Negotiable
MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Shuttlestar
Model Number:
RW-SV550A
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.
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Place of Origin
Guangdong, China
Brand Name
Shuttlestar
Model Number
RW-SV550A
Specifications
Laptop BGA Reballing Tool*SIMENS PLC
*With 2 camera systems
*Large-size bottom IR heating area
*Auto-move optical camera
SV550A laptop motherboard bga reballing tool with two cameras and auto-placement function
Specification
Applicable PCB: |
W20*D20~W550*D500mm |
PCB thickness: |
0.5~4mm |
Working table adjustment: |
±120mm forward/backward, ±80mm left/right |
Temperature control: |
K-type thermocouple, close cycle controlled |
Upper heater(hot air): |
1200W |
Lower heater(hot air): |
800W |
Bottom IR heater: |
3600W |
Power supply: |
AC singal-phase 220V 50/60Hz |
Applicable BGA: |
1*1~70*70mm |
Placement precision: |
0.01mm |
Max BGA weight: |
300g |
Machine Weight: |
90KG |
Machine Dimension: |
L850*W750*H630mm |
......................................................................................................................................................
Features
- Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen;
- Optical vision system can move along with X,Y axis automatically; easy for placement and operation;
- Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550×500mm;
- Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
- Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70×70mm;
- Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles, and compare them with the history saved profiles;with USB for connecting mouse and updating software;
- Color LCD monitor; big size screen, easy to operate;
- Built-in vacuum pump; the max suction up to 80g; 60 °rotation in φ angle,
- 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;
- Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
- Auto pick up chip, auto solder, auto remove, auto placement;
- Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
- Visile monitoring system, can view the melting procee of the balls,(optional).
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Business Type
Manufacturer
Year Established
2000
Factory Size
1,000-3,000 square meters
Total Employees
51 - 100 People
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