New Model SV560 High Vision System BGA Reballing Station for All Kinds of Motherboard
Specifications
BGA/IC/CPU reballing Station (SV560)Auto soldering and desoldering
PLC control,optical vision system
Can work on 2*2mm chip
(SV560) BGA/IC/GPU Reballing Station for all kinds of motherboard
Specifications: (SV560) | |
PCB dimension |
W20*20~500*550mm |
PCB thickness |
0.5~2.5mm |
Working table adjustment |
+/-120mmforward/backward,+/-80mm left/right |
Temperature control |
K-type thermocouple, close cycle controlled |
PCB locating |
Outer |
Upper heater |
Hot gas 1200w |
Lower heater |
Hot gas 800w |
Bottom preheat |
Far infrared 3600w |
Power supply |
Single-phase 220,50/60Hz. 5.5kw |
BGA dimension |
1*1~70*70mm |
Min pitch of BGA ball |
0.15mm |
Placement precision |
0.01mm |
Max BGA weight |
300g |
Machine dimension |
L850*W750*H630mm |
Machine weight |
Approx. 80kg |
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