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Multilayer Vamo PCB Board/fabrication/prototype Manufacture in China

Name: Multilayer Vamo PCB Board/fabrication/prototype Manufacture in China
Brand: Shenunion
SKU: 123017623

US$ 0.001 - 0.001 MOQ: 1 Piece

Key Specifications

Place of Origin:

China

Brand Name:

Shenunion

Model Number:

SLPXL-6LAJ010

Dalian Shenunion Enterprise Development Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

Dalian

Delivery Detail:

Delivery time depends on order quantity.

Place of Origin China

Brand Name Shenunion

Model Number SLPXL-6LAJ010

Number of Layers 6-Layer

Base Material FR4

Copper Thickness 1oz

Board Thickness 1.6mm

Min. Hole Size 4mil

Min. Line Width 4mil

Min. Line Spacing 4mil

Surface Finishing HASL

Specifications

Multilayer Electronic PCB Board manufacture
Professional maufacture
Competitive Price
High Quality
Fast delivery

multilayer vamo PCB board/fabrication/prototype manufacture in China

1.Our service:

1.PCB layout, PCB design

2.Make high difficulty PCB(1 to 38 layers)

3.Provide all Electronic component

4.PCB assembly

5.Write programs for clients

6.PCBA/finished product Test. etc.

2.PCB specifications:

	Item	Specification
1	Numbr of Layer	1-38Layers
2	Material	FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
2	Material
3	Finish Board Thickness	0.2mm-6.00 mm(8mil-126mil)
4	Minimun Core Thickness	0.075mm(3mil)
5	Copper Thickness	1/2 oz min;12 oz max
6	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
7	Min.Hole Diameter for CNC Driling	0.1mm(4mil)
8	Min.Hole Diameter for punching	0.9mm(35mil)
9	Biggest panel size	610mm*508mm
10	Hole Positon	+/-0.075mm(3mil) CNC Driling
11	Conductor Width(W)	0.05mm(2mil)or;+/-20% of original artwork
12	Hole Diameter(H)	PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil)
13	Outline Tolerance	0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
14	Warp & Twist	0.70%
15	Insulation Resistance	10Kohm-20Mohm
16	Conductivity	<50ohm
17	Test Voltage	10-300V
18	Panel Size	110×100mm(min);660×600mm(max)
19	Layer-layer misregistration	4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max
20	Min.spacing between hole edge to circuity pqttern of an inner layer	0.25mm(10mil)
21	Min.spacing between board oulineto circuitry pattern of an inner layer	0.25mm(10mil)
22	Board thickness tolerance	4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil)
23	Impedance Control	+/-10%