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Specifications
1.laser position optical alignment bga rework system2.automatic bga rework station
3.3 years warranty
4.CE certificate
Our factory:
SHENZHEN DINGHUA TECHNOLOGY CO LTD is a manufacturer specialized in design, production and sales of BGA Rework Station, rework tools and associated equipment. We are committed to provide the most advanced equipment with high quality and timely service to our customer. As one of pioneer in this industry, we continue to improve and innovate along with the market demands by absorbing the advanced development experience abroad and adhering to our vision of ‘Professionalism, Honesty, Innovative and Responsibility.
Our service:
a. Your inquiry related to our products or prices will be replied within 24hours.
b. Be Well-trained and experienced to answer all your enquires in fluent English
c. OEM&ODM, any your request we can help you to design and put into product.
d. Distributors are offered for your unique design and some our current models
e. Protection of your sales area, ideas of design and all your private information.
Our Product application:
1. Laptop notebook motherboard bga rework and repair.
2. Game consoles applications such as xbox Ps3 Wii bga rework and repair
3.Large circuit board maintenance, and mobile phone motherboard such small small-sized chip
DH-A5 Infrared SMT SMD BGA Rework Station IRDA Welder parameters:
Power | 6700W |
Top heater | Hot air 1200W |
Bottom heater | Hot air 1200W, Infrared 3900W |
Power supply | AC220V±10% 50/60Hz |
Dimension | L950*W750*H950 mm |
Positioning | V-groove PCB support, and with external universal fixture |
Temperature control | K type thermocouple, closed loop control, independent heating |
Temperature accuracy | ±2°C |
PCB size | Max 450*490 mm, Min 22*22 mm |
Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
BGA chip | 80*80-2*2mm |
Minimum chip spacing | 0.15mm |
Temp Sensor | 5(optional) |
Net weight | 91kg |
BGA rework Station DH-A5 Features:
1.Item name:DH-A5
2. Top Heater and nozzle 2 in 1 design, alignment, placement, welding and remove automatic. Top heater height can be adjust after auto process, user-friendly. Placement height and height of top heater can be set or detect auto.
3.The top heater can move freely along the x,y axis.X-shaped infraded laser can do rapid location. HD color optical alignment system, optical zoom up to 30 times. Alignment can move around to enlarge BGA observation range, fine-tuning accuracy can be 0.01mm
4.Three independent heaters all can set 8 segments heating, cooling and constant temperature, saved temperature profile is unlimited. IR preheat area can be controlled according to PCB size
V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
5.K sensor close loop control and automatic temperature compensation system. It combines with temperature module, which enables temperature accuracy to ±2°C.
6.Hot air nozzles, 360 degree rotation, easy to install and replace, customized is available. the min size 31*31mm,the max size is 55*55mm.
7.HD touch screen interface, PLC control,External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
8.Powerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation.
9.Sound hint system. There is an alarm before the completion of each desoldering and soldering.
10.Packing details
11.CE certification, with emergency switch and automatic power-off protection device when emergency happens
Send Inquiry to This Supplier
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