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Help CenterDH-A3 Laser Alignment BGA/SMD Lead Free Rework Station
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Specifications
HD Optical Alignment3 independent heating zones
HD touch screen interface
K-sensor, close loop control
Specifications:
Power |
6500W |
Top heater |
Hot air 1200W |
Bottom heater |
Hot air 1200W, Infrared 3900W |
Power supply |
AC220V±10% 50/60Hz |
Dimension |
L730*W830*H820 mm |
Positioning |
V-groove, PCB support can be adjusted in any direction and with external universal fixture |
Temperature control |
K type thermocouple, closed loop control, independent heating |
Temp accuracy |
±2°C |
PCB size |
Max 500*400 mm Min 22*22 mm |
Workbench fine-tuning |
±15mm forward/backward, ±15mm right/left |
Camera magnification |
10x-100x |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1-5(optional) |
Placement Accuracy |
±0.01MM |
Net weight |
93kg |
A3 Main Features
lHD touch screen interface, PLC control
lHD color optical alignment system, optical zoom up to 30 times. Alignment can move around to enlarge BGA observation range, fine-tuning accuracy can be 0.01mm
lThree independent heaters all can set 8 segments heating, cooling and constant temperature, saved temperature profile is unlimited. IR preheat area can be controlled according to PCB size
lK sensor close loop control and automatic temperature compensation system. It combines with temperature module, which enables temperature accuracy to ±2°C
lHot air nozzles, 360 degree rotation, easy to install and replace, customized is available.
lV-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
lPowerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation.
lSound hint system. There is an alarm before the completion of each desoldering and soldering.
lCE certification, with emergency switch and automatic power-off protection device when emergency happens
CE certification
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