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Replacement for Bond LED board double sided thermal adhesive sheet
ideal replacement for Bond-ply series/3M8100
Features & Benefits:
-High bond strength to surfaces
-Thermal conductive and electrically isolating
-Excellent wet-out and high thermal performance
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm
Typical Application Includes:
-Where need mount heat sink onto BGA graphic/drive processor
-Where need mount heat spreader onto power converter PCB/Motor
-LED LightingA
Typical properties of 8F10 | ||||||||
Properties |
8F10-T10 |
8F10-T15 |
8F10-T20 |
8F10-T25 |
8F10-T30 |
|||
Reinforced Material |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
Fiberglass |
|||
Thickness |
0.1mm |
0.15mm |
0.2mm |
0.25mm |
0.3mm |
|||
|
Peel Strength (PSTC-101)(N/25mm) |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
>13.72 |
|||
|
Temp Resistance(S) °C (°F) |
180(356) |
180(356) |
180(356) |
180(356) |
180(356) |
|||
|
Temp Resistance(L) °C (°F) |
120(248) |
120(248) |
120(248) |
120(248) |
120(248) |
|||
|
Continues Use. Temp. (°C) |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
|||
Adhesion | ||||||||
|
Retention (1Kg/Inch/25°C) |
>48 |
>48 |
>48 |
>48 |
>48 |
|||
Adhesion(Kg/Inch) |
1.1 |
1.4 |
1.4 |
1.4 |
1.4 |
|||
|
Initial Bonding Strength(Kg/Inch) |
0.6 |
1.3 |
1.3 |
1.3 |
1.3 |
|||
Electricity | ||||||||
Breakdown Voltage |
2 |
2.5 |
3.5 |
4 |
6 |
|||
Thermal | ||||||||
|
Thermal conductivity (ASTM D5470) |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
1.0W/M.K |
|||
Remark:
1.Data for design engineer spec. reference only. Engineers are reminded to test the material in application. 2.Shelf life: Leader recommend a 15-month shelf life at a maximum storage temperature range 23±5°C,relative
humidity is 60% to keep its properties.
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