Laptop Thermal Cooling Pad
Laptop/Notebook Thermal cooling Pads
Features&Benefits:
1.Thermal conductivity:2.0W/m.k
2.High conformability and low hardness
3.Electrically insulating
Typical Application:
1.Laptop,module in computer
2.Between electronic components such as Semiconductor,IC,CPU,MOS and heatsink
3.Cooling Module,Thermal module,in all applications where metel housing is used as heatsink
Configurations:
-Sheet form,die-cut parts
-Tape application available
Size available:
200x400mm
Thickness available:
0.5-12.0mm,increment by 0.5mm
Properties:
Typical Properties of Gap Pad LD8200 | |||
Property |
Unit |
Metric Value |
Test Method |
Color |
*** |
Dark Grey |
Visual |
Thickness |
mm |
0.5-10.0 |
ASTM D374 |
Density |
g/cc |
2.8 |
ASTM D792 |
Hardness |
Shore C |
25±5 |
ASTM D2240 |
Tensile Strength |
KN/m |
0.33 |
ASTM D412 |
Continuous Use Temp. |
°C |
-40-150°C |
EN 344 |
Electrical | |||
Breakdown Voltage |
Kv/mm |
≥6.0 |
ASTM D149 |
Volume Resistivity |
Ω.cm |
1.0×1016 |
ASTM D257 |
Flame rating |
V-0 |
V-0 |
UL 94 |
Thermal | |||
Thermal Conductivity |
W/m.k |
2.0 |
ASTM D5470 |



For more details and application direction,welcome to contact our sales!
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