Termal insulation fr4 g10 substrate laminate sheet

          CCL (CCL) for the printed circuit board (PCB) of the main material, an average of 20 ~ 50% PCB cost of raw materials, consists of reinforcing the strength of fiberglass cloth and epoxy resin insulation plus copper from copper substrates. copper clad laminate
          Technical development CCL functional requirements from the electronics market toward compact size, high reliability, multi Outsider, green technology and high throughput rate trend. Containing a high density interconnect (HDI), high layer count boards (HLC), IC carrier board and high-reliability applications such as automotive panels on computers, mobile phones, and other consumer electronics products, high functional green base with a strong growth potential, will be the focus of future

development PCB products.

FR4 Copper Clad Laminate Sheet
1. Spc : FR-1,FR-4, CEM-1,CEM-3

2. Thickness:0.6,0.8,1.0,1.2,1.6,2.0mm.
3.Copper thickness : single/doule sides

    (H/H, H/0, 0/0, 1/1, 1/H)

4. Width : more than 7~9.9cm , 10~14.9cm , 15cm up , with different prices.

5.Length : 30~120cm

   We JIN CHEN JIA TECHNOLOGY CO.LTD.,not only professional for producing Copper Clad Laminate, unclad laminate, prepreg since 2006, we also have very relationship with Taiwan's big electronics company, such as Taiwan Nanya , Taiwan glass , so we can get very competitive price for the products, if you have interest please just feel free to contact us in work's time.