Fiberglass Thermal Interface pad for ODM Inverter

Specifications

Fiberglass Thermal Pad
-ODM Inverter Thermal interface pad
-Standard size:200*400mm
-Industry direct price
-ROHS & UL listed

The HCG/HCP ODM Inverter Fiberglass Thermal interface pad is an anti-piercing & anti-tearing product with a high shear strength , which consisted by the low modulus polymer attached to the glass fiber substrate, so the product can be used as a filler between the machine’s contact interface.

 

Features & benefits:

1.Low hardness with ultra-conforming

2.Enhanced shear strength, piercing and tearing resistance

3.Electrically isolating

4.Meet with the environmental requirements of ROHS and UL

 

Typical applications:

1.Communications industry /AC/DC power

2.Power conversion equipment

3.The framework, chassis or other area need to transfer heat

4.HID ballast

5.Auto control unit (ECU)

6.Uninterruptible power supply(UPS)

 

Physical properties: 

Test item	Test method	Unit	HCG240 Test value	HCP240Test value
Color	Visual		Light blue	Incanus+Pink / Incanus+Gray
Thickness	ASTM D374	Mm	0.25 /0.3 /0.5	0.5 to 13.0
Specific Gravity	ASTM D792	g/cc	1.6	1.8±0.1
Hardness	ASTM D2240	Shore C	25±5	25±5
Tensile Strength	ASTM D412	kg/cm2	8	8
	ASTM D412	Pa	5.88*109	5.88*109
Continuous Use Temp	EN344	°C	-40 to +220	-40 to +220
Volume Resistivity	ASTM D257	Ω-CM	5.0*1013	1.0*1011
Breakdown Voltage	ASTM D149	KV/mm	>5	6
Flame Rating	UL-94		V-0	V-0
Conductivity	ASTM D5470	w/m-k	1.5 to 3.0	1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Configurations available: 200mm*400mm, 300mm*300mm, specific size could be provided according to your requirements.