High thermal conductivity pad between heatsinks and IC

Specifications

High thermal conductivity pad
-Thermal insulation
-Thermal conductivity:>3.0w/m-k
-Industry direct price
-ROHS & UL listed

The HCH Thermal silicon pad with high thermal conductivity between heat sink and IC is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

 

Features & benefits:

1.High compressibility, soft and flexible, designed for applications in low-stress application environment

2.Nice thermal conductivity

3.Electrical insulation

4.Meet with the environmental requirements of ROHS and UL

5.Natural stickiness

 

Typical applications:

1.Laptop

2.Communication hardware equipment

3.High-speed hard disk drive equipment

4.Automobile engine control mould

5.Micro processor, memory chip and graphics processor

6.Mobile equipment

 

Physical properties:

Test item	Test method	Unit	Test value of HCH series
			HCH600 value	HCH500 value
Color	Visual		Blue/Laterite	Blue/Yellow
Thickness	ASTM D374	Mm	0.25 to 5.0	0.25 to 5.0
Specific Gravity	ASTM D792	g/cc	2.85	2.7
Hardness	ASTM D2240	Shore C	30	30
Tensile strength	ASTM D412	kg/cm2	55	55
Continuous Use Temp	EN 344	°C	-40 to 220	-40 to 220
Volume Resistivity	ASTM D257	Ω-cm	3.1*1011	3.1*1011
Breakdown voltage	ASTM D149	KV/mm	>5.0	>5.0
Flame Rating	UL-94		94-V0	94-V0
Conductivity	ASTM D5470	w/m-k	6.0	5.0

 

Configurations available: 200mm*400mm, 300mm*400mm;  specific size could be provided

according to your requirements.