Hasl Lead Free Pcb
Specifications
PCB Board and PCB Assembly1.Express fr4 pcb prototypes and mass production
2.Experienced staff
3,pcb,pcb assembly,component
Product Technical Specification of Moko Technology Ltd | |||
Item |
Parameter |
||
Double sided |
Multilayer |
||
Number of Layers |
2 |
4~16 |
|
Copper Thickness |
0.25~3.0OZ |
0.5~3.0OZ |
|
Base Board Thickness |
0.3~3.2mm |
0.6~3.2mm |
|
Incombustibility |
94V-0 |
94V-0 |
|
Peelable resistance |
12.3N/cm |
12.3N/cm |
|
Twist |
≤0.5% |
≤0.5% |
|
Insulation resistance |
≥1011Ω |
≥1011Ω |
|
Test voltage |
10-300V |
10-300V |
|
Finished board area |
560×970mm |
560×970mm |
|
Min. Line Width and Spacing |
0.1/0.1mm |
0.1/0.1mm |
|
Copper thickness in hole |
≥25.0um |
≥25.0um |
|
Mini. pad diameter |
Inner layer |
|
0.05mm |
Out layer |
0.076mm |
0.076mm |
|
Mini. Hole Diameter |
0.25mm |
0.20mm |
|
Hole tolerance |
PTH |
±0.076mm |
±0.076mm |
NPTH |
±0.05mm |
±0.05mm |
|
Hole location tolerance |
±0.076mm |
±0.05mm |
|
profile tolerance |
Routing |
±0.1mm |
±0.1mm |
Punching |
±0.13mm |
±0.13mm |
|
Solder mask bridge ability |
≥0.1mm |
≥0.075mm |
|
Solder mask rigidity |
6H |
6H |
|
Solderable test |
245 Degrees Centigrade 5 second |
245 Degrees Centigrade 5 second |
|
Thermal cycling ability |
288 Degrees Centigrade 10 second |
288 Degrees Centigrade 10 second |
|
Surface Finishing |
OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger |
OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger |
|
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