Large-size gold-plated fpc board

Inner packing :Vacuum Package
Outer packing:Standard Carton packing

Our PCB got UL,SGS,ISO9002,RoHS,QS9000 and TS16949 certificates,and are used to a wide range of fields such as computers, digital products,medical equipment, automobiles, communication devices, military,  industrial control and aviation. 

PCB process capability:
1.Layer:  2-22 layer
2.Product type:  Rigid PCB,High Density Inverter PCB,thick copper PCB
3.Materials:  FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg
4.Copper Thickness:  140micron(4oz)
5.Min Board Thickness:  0.4mm
6.Max Board Thickness:  5.0mm
7.Min finished Hole Diameter:  0.1mm
8.Outer layer line width / spacing:  0.1mm/0.1mm
9.Inner layer line width / spacing:  0.1mm/0.1mm
10.Min aperture:   0.2mm
11.Min Laser drilling:  0.1mm
12.Min  Ring Width:  0.11mm
13.Min BGA-bit hole spacing:  0.4mm
14.Resistance Tolerance:  ±10%
15.Minimum Insulation Thickness:  3mil
16.Maximum laser blind hole thickness to diameter ratio:  0.8:1
17.Maximum working board size:  520*622mm
18.Drilling Tolerance (PTH):  ±0.075mm
19.Drilling tolerance (NPTH):  ±0.05mm
20.Outline Tolerance (CNC):  ±0.13mm
21.Surface coating:  Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask

PCB production capacity
Double sided PCB :200000 ft2 /Month
Multilayer PCB  :320000 ft2/Month
HDI  PCB  :    80000 ft2/Month

All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.