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Help CenterCost Low HT 390 3 Temperature Zones Hot Air Infrared Heating Bga Rework Station for Laptop Motherboard
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Specifications
1.HT R390 bga rework station for laptop motherboard2.hot air IR preheating
3.3 temperature zones
4.for xbox ps3 laptop chips
top use hot air local heating .bottom use IR extensive heating .
do like this not only keep Persistence of temperature soldering (especially leadfree soldering )
but also decrease deformation of PCB or BGA IC because the bottom IR extensive preheating .
makes machine break the limit of IR station and hot air station and support multiple mainboard and chip repairing
HT - R390 advantage:
1, HT - R390 is three temperature area products.
2, HT - R390 fluctuation sirocco all USES high-grade temperature control meter.
3, HT - R390 fluctuation hot air heating, infrared preheating.
The specifications and technical parameters:
1. The total power: 3800W
2. Upper heating power: 800W
3. Bottom heating power: 800W, bottom infrared heating power: 2200W
4. Use single-phase 220V power: AC 50/60HZ 3KVA
5. Shape dimension: the body part 420 * * 500 550MM
6. The temperature control: high-precision K type thermocouples.
7. Localization way: v-shaped fissure card slot PCB positioning, maximum adapt PCB size 320 * 375MM
8. Machine weight: about 28KG..
Features:
1. With high precision temperature control instrument imported raw materials (PLC). J heater precise control of BGA desoldering process.
2. The machine USES three temperature area independent control, temperature control more accurate.
The first temperature area. The second temperature area all can set 8 paragraph litre (drop) temperature + 8 section temperature control, can also store 10 team temperature curve.
The third temperature area USES far infrared heating board preheat, independent temperature control, ensure the welding process of PCB can comprehensively preheating,
3. The machine has the computer communication function, the built-in PC serial port, external temperature measuring interface, equipped with software, computer control can be realized.
4. Imported high-precision thermocouples, realize the temperature of precision detection.
5. Using upper heating and bottom heating temperature curve way walk alone, cross-flow rapid cooling fan, guarantee the principle in PCB welding process, won't be out of shape.
6. Desoldering and welding finished with alarm functions, equipped with vacuum pen, convenient desoldering suction trip after BGA.
7. PCB positioning of the card slot, v-shaped fissure of flexible and convenient portable universal fixtures, to protect PCB.
8. For big heat capacity PCB and other high requirements, lead-free solder can easily handle.
9. Sirocco can rotate 360 degrees arbitrary time-and-labor-saving, easily replaced. Equipped with a variety of sizes sirocco can be customized tip special requirements.
Suitable for laptop computer motherboard, desktop computer motherboard, etc. Large circuit board maintenance, and mobile phone motherboard such small small-sized chip maintenance
Machine parts have
Nozzles----------------------------------------------------X 5 25 x 25, 29x 29, 34x34, 40x40, 50x50;
Aluminium plate for BGA IC reballing---------------- X 1
software---------------------------------------------------X 1
data line -------------------------------------------------- X 1
manual------------------------------------------------------X 1
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