Double-layer,multi-layer Printed Circuit Board PCB
I. Standard specifications:
| Layer | Normal terms for PCB |
| 2L | 1. Sheets requirement: FR-4(Tg140), |
| 4L | 2. Sheet thickness:1.6mm |
| 6L | 3. Copper thickness of :1Oz |
| 8L | 4. Surface treatment:Hasl(with lead)/OSP |
| 5. Minimum wire width/space:5/5mil | |
| 6. Minimum hole diameter: 12mil | |
| 7. Routing space≤28M/square meter | |
II.Addtional specification
| Item | Increase percentage | |||
| Surface treatment | Immersion Gold | |||
| Immersion Silver | ||||
| Hasl without lead | ||||
| Carbon oil | ||||
| Blue glue | ||||
| Final sheet thickness | 0.4≤sheet thickness | |||
| >1.6mm | ||||
| Impedance control | Single end impedance | |||
| Differential impedance | ||||
| Single/Differential impedance | ||||
| Minimum wire width/space | ≤4.0/4.0mil | |||
| Final copper thickness(2L) | 1.5Oz | |||
| 2 OZ | ||||
| 3 OZ | ||||
| Requirement of sheet material | ≤ Tg150 | |||
| ≤ Tg170 | ||||
| solder mask ink | matte ink | |||
| Black ink | ||||
| Plugged hole | ||||
| Hole diameter thickness ratio | ≥6:1 | |||
| 28>hole copper≥25 | ||||
| ≥28 | ||||
| Final minimum hole diameter | ≤ 0.25mm | |||
| Lamination and additional process | Add PP | |||
| Addtional processing | ||||
| Routing | Routing space≥28M/square meter | |||
| Minimum knife≤1.2MM | ||||
| Hole Nos. | Number | |||
| Countersunk hole | ||||
| V-CUT | General V-Cut | |||
| Discontinuous V-Cut | ||||
| Beveling of G/F | Exotropia | |||
| Single PCS scrap | If shipped by SET then,single PCB scrap is do not acceptable | |||
Note:This specification is customized.
Details:
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