FR-4 copper clad laminate sheet for circuit board made in China

THICKNESS

COPPER FOIL

SIZE

THICKNESS TOLERANCE

Inch

mm

oz(μm)

Inch

mm

0.002

0.05

1/3(12) 1/2(17)

36×48

&37×51

915×1220

&940×1300

IPC-4101C C/M

To

1.0(35) 2.0(70)

40×48

&41×51

1020×1220

&1040×1300

0.125

3.2

3.0(103)

42×48

&42.5×51

1070×1220

&1080×1300

HRFR-4 Laminate

Unit

specification

Typical Value

Test 
Method

Metric

<0.5mm

≥0.5mm

1.6mm  CCL

IPC-TM-650

1. Peel Strength,as received

N/mm  

1.80
(1OZ )

---

A. 17micron copper

≥0.79

≥1.05

B. 35micron copper

≥1.05

≥1.40

C. 70micron copper

≥1.40

≥1.93

D. 105,140,175micron copper and above

≥1.58

≥2.10

2.  Surface resistivity

MΩ

---

5.4×107

5.6×106

A. Constant temp.&moisture C-96/35/90

≥104

---

B. After moisture resistance 

---

≥104

C. Under high temperature 

≥103

≥103

3. Volume resistivity

MΩ.cm

---

5.4×108

5.6×106

A. Constant temp.&moisture C-96/35/90

≥106

---

B. After moisture resistance 

---

≥104

C. Under high temperature

≥103

≥103

4. Moisture absorption

%

---

≤0.80

0.15

5. Dielectric breakdown

KV

---

40

50

6. Permittivity at 1MHZ

--

<5.4

<5.4

4.6

7. Tg(DSC)

°C

---

≥130

138

8. Loss tangent at 1MHZ

--

<0.035

<0.035

0.015

9. Pressure Vessel Method

260°C/20S

pass

pass

pass

pass

pass

pass

10. Thermal stress

288°C/20S

Non etching

pass

pass

pass

Etch

pass

pass

pass

11. Flammability

Rating

94V-0

94V-0

94V-0

12. Dimensional stability

ppm

---

±300

±180