FR-4 mid-tg/tg 150 copper clad laminate/laminate sheet/ccl for communication device

THICKNESS

COPPER FOIL

Dimension

THICKNESS TOLERANCE

Inch

 mm

oz(μm)

Inch

  mm

0.002

0.05

1/3(12) 1/2(17)

36×48

&37×51

915×1220

&940×1300

IPC4101C C/M

to

1.0(35) 2.0(70)

40×48

&41×51

1020×1220

&1040×1300

0.125

3.2

3.0(103)

42×48

&42.5×51

1070×1220

&1080×1300

HRM-4150 Laminate

Unit

specification

Typical Value

Test Method

Metric

<0.5mm

≥0.5mm

1.6mm  CCL

IPC-TM-650

1. Peel Strength,as received.

N/mm

1.80
(1OZ )

---

A. 17micron copper

≥0.70

≥0.7

B. 35micron copper

≥0.79

≥1.05

C. 70micron copper

≥0.88

≥1.40

D. 105,140,175micron copper and above

≥0.96

≥1.58

2. Surface resistivity

MΩ

A. Constant temp.& moisture C-96/35/90

≥106

---

---

B. After moisture resistance 

---

≥104

3.6×107

C. Under high temperature 

≥103

≥103

2.8×106

3. Volume resistivity

MΩ.cm

A. Constant temp.& moisture C-96/35/90

≥106

---

---

B. After moisture resistance 

---

≥107

6.5×108

C. After moisture resistance 

≥103

≥103

5.6×106

4. Moisture absorption

%

---

≤0.5

0.12

5. Dielectric breakdown

KV

---

40

50

6. Permittivity at 1MHZ

--

<5.4

<5.4

4.7

7. Tg(DSC)

°C

---

150±5

150

8. Loss tangent at 1MHZ

--

<0.035

<0.035

0.020

9. Thermal stress

288°C/20S

Non etching

pass

pass

pass

Etch

pass

pass

pass

10. Flammability

Rating

94V-0

94V-0

94V-0

11. Flexural strength of laminate

Length direction

N/mm2

---

≥415

515

Cross direction

---

≥345

405

12. Glass Transition Temperature

°C

---

≥340

350(TDloss5%)

13. Z-Axis CTE

A.  Before Tg

PPM/°C

---

---

45

B. After Tg

PPM/°C

---

---

250

C. 50-260°C

%

---

---

2.8