Home > Products > aluminum base sheet > 2.0w Metal core copper clad laminate sheet-MCCL
2.0w Metal core copper clad laminate sheet-MCCL
- 500 Sheet / Sheets per Month
- Shanghai
- T/T L/C D/P D/A Credit Card PayPal
Product Details
Place of Origin: | Anhui, China | Brand Name: | Hero Sail | Model Number: | HRA-5110 |
Base Material: | Epoxy glass,fiberglass | Copper Thickness: | 1/0(35/00micron) | Board Thickness: | 1.0,1.2,1.5,1.6,2.0mm |
Product Description
Specifications
1.UL,SGS,CQC,VDE,TS16949,RoHS,MSDS2.Excellent electromagnetic shielding
3.2.0w Metal core copper clad laminate sheet-MCCL
2.0w Metal core copper clad laminate sheet-MCCL
Structure:
Circuit layer----Made of compressed electrolytic copper foil
Insulating layer----Plexiglass,inorganic glass
Metal base----Aluminum plate,copper plate
Standard dimension:
Kind | Type | Heat conductivity (W/m.k) | Thickness of insulating layer(um) | Standard dimension(mm) | Thickness of copper foil(OZ) | Thickness of AL plate(mm) | AL type |
AL base ccl | HR 5100 | 1.0 | 60-200 | 1000x1200(Customized) | 1oz~6oz | 0.2mm~3.2mm | 1060 5052 6061 |
HR 5110 | 2.0 | 60-200 |
HR-5100:(1W series)Normal Heat-transfer performance
Target item | Treatment condition | Unit | Value | Testing results |
Heat conductivity | A | W/m·K | ≥ 1.0 | 1.18 |
Flammability | E-24/125 | ------ | V-0 | V-0 |
Volume resistivity | E24/125 | MΩ·cm | ≥103 | 2.3×108 |
Surface resistivity | E24/125 | MΩ | ≥103 | 5.6×105 |
Dielectric breakdown | D-48/50 D-0.5/23 | KV/AC | ≥2 | 4.2 |
Peel Strength | A | N/mm | ≥1.05 | 1.60 |
Thermal stress | 288°C,tin dipping | - | ≥30S(no delamination) | 133S |
Moisture absorption | D-24/23 | % | ≤0.80 | 0.11 |
HR-5110:(2W series)Super High Heat-transfer performance
Target item | Treatment condition | Unit | Value | Testing results |
Heat conductivity | A | W/m·K | ≥2.0 | 2.1 |
Flammability | E-24/125 | ------ | V-0 | V-0 |
Volume resistivity | E24/125 | MΩ·cm | ≥103 | 1.7×108 |
Surface resistivity | E24/125 | MΩ | ≥103 | 8.9×105 |
Dielectric breakdown | D-48/50 D-0.5/23 | KV/AC | ≥2 | 4.3 |
Peel Strength | A | N/mm | ≥1.05 | 1.53 |
Thermal stress | 288°C,tin dipping | - | ≥30S(no delamination) | 244S |
Moisture absorption | D-24/23 | % | ≤0.80 | 0.13 |
Details:
FAQ
Q: 1. Can I have free samples?
A: Yes, we can provide free samples only for small size after you accept our price and all the information confirmed by you.
Q: 2. What is the manufacturing time?
A: Sample needs 1-3 days, mass production needs 7-10 days, It depends on quantity.
Q: 3. What is your MOQ?
A: Our MOQ is 300 sheets for copper clad laminate,and 300 meters of prepreg.
Q: 4. Can you accept mixed batch of different products?
A: Yes, we are support different product mix wholesale.
Q: 5. How do you ship the goods?
A: For huge quantity,we can deliver it by FCL,for small quantity,we can deliver by LCL,samples will deliver by DHL,FEDEX,UPS,etc.
Any other questions,pls feel free to leave a message.We are looking for your inquiry!
Contact Us
- Tongling HaoRong Electronic Technology Co., Ltd.
- Contact nameDemi Wang
- Phone86-0562-2652070
- AddressETDZ Tongling,Anhui
aluminum base sheet | CEM-1 series | CEM-3 series | Copper clad laminate |
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