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Gold CPU Silicon Thermal Compound
- Shenzhen/Huangpu
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Product Details
| Place of Origin | Guangdong, China | Classification | Other Adhesives | |
| Main Raw Material | Silicone | Usage | Construction, Other, Construction, Fiber & Garment, Footwear & Leather | |
| Model Number | GD660-TU5 |
Product Description
Specifications
silicon thermal compound*Color:Gold
*Paste weight:5g /1.1oz
*Thermal conductivity:3.2W/m-k
*Thermal resistance:<0.159-in2/W
silicon thermal compound
theromal paste
Thermal Grease Paste
CPU silicon thermal Grease/grey thermal paste/heatsink compounds Introductions
This thermal grease paste is suitable for CPU heatsink or chip, and it is syringe design for easy operation.
Features:
Syringe design for easy operation.
Helps disperse the heat from CPU to heatsink effectively.
Suitable for CPU heatsink or chip.
High temperature resistance.
Non-toxic, tasteless, non-corrosive.
Primary use: Thermal coupling of electrical / electronic devices to heat sinks.
Special properties: High conductivity; low bleed; stable at high temperatures.
| Item | Unit | Environmental | Test method | WT160 | WT180 | GY260 | GY280 | GD660 | GN680 |
| Color | No | 25 °C | Visual | WHITE | WHITE | GREY | GREY | GOLD | GREEN |
| Thermal Conductivity | W/m-K | No | ROCT8.140-82 | >0.6 | >1.2 | >1.0 | >1.4 | >2.4 | >2.0 |
| Thermal Impedance | °C-in2/W | 25°C | ASTM D1470 | <0.258 | <0.200 | <0.211 | <0.180 | <0.159 | <0.167 |
| Specific Gravity | No | 25°C | ASTM D1475 | >2.0 | >2.4 | >2. | >2.4 | >2.5 | >2.4 |
| Evaporation | % | 150°C/24Hours | Fed.Std.791 | <0.001 | <0.001 | <0.001 | <0.001 | <0.001 | <0.001 |
| Bleed | % | 150°C/24Hours | Fed.Std.791 | <0.05 | <0.05 | <0.05 | <0.05 | <0.05 | <0.05 |
| Dielectric Constant A | No | 100Hz | ASTM D150 | >5.0 | >5.0 | >5.0 | >5.0 | >5 | >5.0 |
| Viscosity | No | 25°C | ____ | No flow | No flow | No flow | No flow | No flow | No flow |
| Penetration Degree | 1/10 mm | 25°C | GB/T-269 | 380±10 | 380±10 | 380±10 | 380±10 | 380±10 | 380±10 |
Specification:
Color: Gold
Paste weight: 5g / 1.1oz
Thermal conductivity:3.2W/m-k
Thermal resistance: <0.159 °C-in2/W
Package list:
1 * 5g GoldThermal Grease Paste
30pcs/bag
3000pcs/ctn
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Our service:
1.OEM silicon thermal compound pack,we could do free design as customer requirement.
2.With our own brand carton or as customer requirement if qty up to 10k.
3.Protection of your sales area,ideas of design and all your private information.
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Payment term:
1.Payment:T/T only,30%deposit,the balance before delivery.
2.Production leading time:10-15days,see qty to confirm.
3.Shipping out:Guangzhou or Shenzhen.
Contact Us
- Guangzhou Uni-Works Computer Ltd.
- Contact nameamy sun Chat Now
- Phone86-20-87089325
- AddressB of 102,the first floor,No.5 2nd qiaoyuan street,Tianhe strict,Guangzhou,China, Guangzhou, Guangdong
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