Factory direct 3HE 50W semiconductor laser engraving machine,metal laser engraving machine,laser engraving machine for press

wood box

Specifications

semiconductor laser engraving machine
high electrooptical conversion efficiency
small volume
low energy consumption

3HE 50W   semiconductor laser engraving machine,metal laser engraving machine,laser engraving machine for press

 

  

Principle and Features:

3HE-DP50 semiconductor side-pump laser marking machine adopts the international advanced laser technology, uses semiconductor diode pump of wavelength 808 nm and ND:YAG medium. The medium produces a large number of inversion population, forms and outputs giant pulse laser light of wavelength 1064 nm through regulation of Q, enjoying high electrooptical conversion efficiency, small volume and low energy consumption.

Key parts of this series of marking machine are imported with original package, which guarantees marking accuracy, high speed and stable performances, and enables the marking machine to work uninterruptedly for a long time. Compared with traditional lamp pump marking machine, it has advantages of wider range of application. It is much easier to coordinate with various production lines and can realize on-line marking.

The marking machine software is applicable for XP system, featured with simple operation and complete functions. It is compatible with AutoCAD, CORELDRAW, Photoshop and other file formats, such as PLT, DXF, BMP, JPG, and they can directly use the TTF word stock.

 

Scope of Application:

 

Lucent's press widely used mobile phone keypad, plastic, electronic components, integrated circuits (IC), electrical appliances, telecommunication products, signage, sanitary ware, hardware, tools, accessories, precision instruments, eyeglasses and clocks, jewelry, car accessories, bag buckles, knives, locks, PVC tubing, stainless steel products, medical equipment and other industries.

Suitable materials include: can any metal (including precious metal), plastics, plating materials, coating materials, plastics and rubber, epoxy resin, ceramics and other materials marked on the high resolution, very beautiful images.

 

Technical Parameters:

 

Laser output power	≤50W
Laser wavelength	1064nm
Laser beam quality m2	<6
Frequency of Q-switched modulation	≤50KHz
Standard marking range	100mmx100mm
Matching marking range	70mmx70mm/150mmx150mm
Marking depth	≤2mm
Holistic power	1.5KW
Min. line width	0.015mm
Re-precision	±0.0025mm
Marking speed	≤7000mm/s
Overall dimensions(Length*width*height)
Host system dimensions	870mmx850mmx1320mm
Cooling method	water

Marking samples: