RGB LED matrix array

Specifications

RGB LED Matrix Array
1.DIP/SMT
2.From prototypes to mass production
3.Certificates:UL,ROHS,ISO9001

Your Best Choice for Printed Circuit Board Manufacturing & Assembly

 

 

OEM/ODM/EMS Services for PCBA:

• PCBA, PCB Board assembly: SMT & PTH & BGA
• PCBA and enclosure design
• Components sourcing and purchasing
• Quick prototyping
• Plastic injection molding
• Metal sheet stamping
• Final assembly
• Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
• Custom clearance for material importing and product exporting

Capability - SMT

• Lines                   9(5 Yamaha,4KME)
• Capacity                 52 million placements per month
• Max Board Size           457*356mm.(18”X14”)
• Min Component size       0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
• Speed                   0.15 sec/chip,0.7 sec/QFP

Capability - PTH

• Lines                   2
• Max board width         400 mm
• Type                   Dual wave
• Pbs status               Lead-free line support
• Max temp               399 degree C
• Spray flux               add-on
• Pre-heat                 3

Technical Data:

 

Stencil size/range:	736x736mm
Minimum IC pitch:	0.30mm
Maximum PCB size:	1200x 500mm
Minimum PCB thickness:	0.35mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Frequency of stencil cleaning:	1 time/5 to 10 pieces

 

Turn Times:	Quick turn are our Specialty
Volume:	One piece to low valume production quantityes Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Stencil:	Laser cut stainless steel
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection.

 

 

 

 

AOI Testing

• Checks for solder paste
• Checks for components down to 0201"
• Checks for missing components, offset, incorrect parts, polarity

 

X-Ray Inspection

X-Ray provides high-resolution inspection of:

• BGAs
• Micro BGAs
• Chip scale packages
• Bare boards

 

In-Circuit Testing

In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.

• Power-up Test
• Advanced Function Test
• Flash Device Programming
• Functional testing

 

Our partners:

Applications:

Defence, broadcasting,medical,telecommunication systems,industrial control, traffic intelligence systems, auto industry, agriculture and so on.

 

About Fulltronics:

 

Our service: Design/Layout of Printed Circuit Boards, PCB Fabrication, Component Assembly, Wire Harness Assembly, Box Assembly, Parts Procurement, Component Forming and Electrical Testing.

We are certified with: ISO9001 & ts16949, UL Certification and ROSH if required.

 

Why choose us? 

We purchase material from Original Company and distributers.

We make products by strict engineer processes.

We have strict inspection processes.

We send products by vaccum package,antistatic package and carton box.

 

Quote Requirements for PCB and PCB Assembly:

- Gerber File and Bom List;
- Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if avaliable.
- Inspection method for PCB Assembly.