Contact Platform Support
Help CenterDPC Process Aluminum Nitride Ceramic-based PCBs Supplied by Silitronics
Related Products
The ceramic PCB material for semiconductor refrigeration chip packages generally refers to the ceramic substrate material used in the manufacture of semiconductor refrigeration chip packages. It has excellent thermal conductivity, mechanical strength, and temperature stability, making it suitable for use in harsh electronic equipment and semiconductor device applications such as high-frequency, high-power, and high-temperature applications, such as lasers, power amplifiers, high-performance LED lighting, wireless communication equipment, etc. Common semiconductor refrigeration chip package ceramic PCB materials include AMB, AlN, AI2O3, etc., among which AMB material is a ceramic material with high thermal conductivity and high electrical insulation performance commonly used in the manufacture of semiconductor refrigeration devices.
Send Inquiry to This Supplier
You May Also Like
-
Sliton Single & Double-sided Ceramic PCB.US$ 1 - 2MOQ: 1 Piece
-
Copper Coated Ceramic Substrate.US$ 1 - 2MOQ: 1 Piece
-
Double-Sided Gold-Plated Ceramic PCB.US$ 1 - 2MOQ: 1 Piece
-
Ceramic Circuit Board With LED Heat Dissipation.US$ 1 - 2MOQ: 1 Piece
-
Customized Integrated Circuit Board.US$ 1 - 2MOQ: 1 Piece
-
High Power LED COB Ceramic Substrate.US$ 1 - 2MOQ: 1 Piece
-
COB Ceramic Substrate Integrated.US$ 1 - 2MOQ: 1 Piece
-
Ceramic Substrate for High Brightness LED Applications Substrate Material.US$ 1 - 2MOQ: 1 Piece
-
High Power LED COB Ceramic Substrate.US$ 1 - 2MOQ: 1 Piece
-
Customized Integrated Circuit Board.US$ 1 - 2MOQ: 1 Piece
