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Help Center4 Layers PCB and PCBA Assembly Board
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Specifications
4L PCB assembly- upto 16 layers pcb
- smd through holes assembly
- IPC610 pcba standard
- 2 weeks fast delivery time
Specifications
4 Layers PCB & PCBA Assemblies board
1. material:FR-4 (thickness from 0.2mm~2.4mm)
2. surface finished: HASL,SOP,Immersion Gold
3.3000 square meter pcba factory
4. RoHS approved PCB
4L PCB Assembly Service:
- Printed circuit board assembly
- Upto 16 layers bare pcb making
- Compoents sourcing and purchasing
- Lead free PCB assembly (RoHS)
- PCBA turnkey
- SMT assembly
- DIP assembly
- Through hole assembly
- wave solder machine process
PCBA assembly Manufacturing Capability:
| PCB Layers | 1Layers to 16 layer (Max) |
| PCB Material | FR4 bare pcb |
| PCB Copper thickness | 18um,35um,70um,105um,140um |
| Surface finish of PCB | HASL, ENIG,OSP |
| PCB Min holes | 0.15mm |
| PCB Min wire width | 0.15mm |
| PCB Min clearance | 0.15mm |
| PCB Dimension scope | 457x567cm(max);4x3cm(min) |
| IC Pitch(min) | 0.2mm |
| Chip Size(min) | 0402/1005(1.0x0.5mm) |
| BGA Size | 8x6mm~55x55mm |
| BGA Pin Count | 48pins~600pins |
| Package | SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| u-BGA ball dia. | 0.2mm |
Type of Assembly |
SMT and Through hole assembled board |
Solder Type |
Both Lead and Lead free available |
Component |
0402components Ball grid array (BGA) double side pcb SMT assembly Through-hole and mixed technology assembly DIP wave soldering |
Type of Service |
Turn-key, Partial Turn-key, Consignment |
Testing |
In circuit Testing(ICT) Functional testing(FCT) XRAY Inspection |
Quality Standard |
IPC-A-610E Class 2 ISO9001 |
Capacity |
SMT: 15,000 pieces per day(suppose 100pcs chips/borad) 10,000pcs per day for DIP |
File Format |
BOM list in Excel file Gerber files Testing procedure (*.doc format) |
PCBA FACTORY Photos
Send Inquiry to This Supplier
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