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Auto PCB / FPC Soldering Machine
Technology parameters
| Model | CWPC-1A |
| Max. Working Area | 200mm X 260mm |
| Size | 620mm X 690mm X 570mm |
| Weight | 95Kg |
| Air Pressing | 0.45-0.7Mpa |
| Temperature setting |
20-500C
|
| Temperature precision |
+-2
|
| Bonding time |
1-99s
|
| Precision |
0.05
|
| Bonding Force |
0.1-0.6 Pa
|
Features for PCB / FPC Soldering Machine
Pulse-Heated Soldering Machine with Pneumatic Rotary Turntable CWPC-1A
1.Extremely short cycle time with rotary table design. Product loading and unloading can be done during the heat sealing process
2.High quality heat seal application up to 0.25mm pitch
3.Pneumatic bonding head provide up to 3,900N force
4.Digital programmable pressure control with LCD display
5.Closed loop PID temperature control with visible LED display
6.Bonding cycle is triggered by a real time pressure sensor
7.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
8.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
9.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application
10.Full microprocessor logic control
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