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Picosecond Laser Precision Micromachining System

Picosecond Laser Precision Micromachining System photo-1
Negotiable MOQ: 1 set (Price negotiable depending on order volume and customization)
Key Specifications
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Laser Type:
Semiconductor
Place of Origin:
China
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
Delivery time depends on order quantity.
Laser Type Semiconductor
Place of Origin China

Specifications

perform high quality micro-drilling, cold-cutting, grooving and milling

Pico Second Laser Precision Micro Machining System is equipped with ultra short pulse lasers . The system is specially designed to perform high quality micro-drilling, cold-cutting, grooving and milling. With minimum thermal effect, free selection of taper and debris free, Deep Pioneer has realized many applications with Metal, Ceramic, Semiconductor and Polymers, which will sure meet your needs.

Specifications
Wavelength : 1064, 532 or 355nm
Pulse Width : < 12ps
Average Power : 2W, 10W and 25W
Frequency : 200Khz to 1 MHz
Minimum Diameter : 30um
Maximum Aspect Ratio : 20 : 1
System dimension : 2.5m &times; 1.2m &times; 2m (L&times;W&times;H)

Features
No thermal effect & Smooth processing edge
Not selective to materials
Suit for processing any structures
Free selection of taper(Positive, negative or zero)
High throughput due to high repetition rate and high power

Applications
Micro-drilling, micro-cutting, grooving, milling in Metal, Ceramic, Semiconductor,Polymer, glass and other materials.

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Business Type
Manufacturer, Trading Company
Year Established
1980
Factory Size
Below 1,000 square meters
Total Employees
101 - 200 People