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Specifications
1.simple structure2.Heating up fast
3.Energy Saving
4.Meet Rohs
Introduction:
Specifications
1.Metallized Ceramic Substrate by Laser cutting
2.Good corrosion and wear resistance
3.Good heat conductivity, fire resistan
Lapping Metallized Alumina Ceramic Substrate
Features:
1.Special types are available according to customer's drawings or samples
2.Various size to very tight dimensional tolerances.
3.Excellent mechanical, electrical and thermal characteristics.
4.Various sizes and pattern design,Excellent bonding strength.
It is a high temperature (1650deg C) co-sintered ceramic heater that is made by printing
a metal resistor on a sheet of alumina ceramic.
Advantages:
1. simple structure
2. Heating up fast. within 10 seconds, can reach to 100°C-230°C;30s can 500°C-700°C
3. High thermal efficiency, energy saving with no pollution. Meet Rohs requirement.
4. Even heating ,no flame ,and use safely
5. Longlife
Physical properties
1Density: ≥3.6g/cm3
2.Bending Strength: ≥ 270MPa
3Compression Strength: 2700MPa
4Tensile Force: 180°C direction from leads: ≥5kgf
90°C direction from leads: ≥3.5kgf
Temperature Property
1.Working Temperature:100°C-230°C
2.Max Temperature: 500°C-700°C
3.Heating Rate: within 30sec., can reach to working temperature; within 90 sec. can reach to max temperature.
Regular thickness:
0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm, 2.0mm
Metallization:
The surface can be covered a lay of metallization,such as Ag, Pd-Ag,Mo-Mn, Ni-plating with good tensile strength:
Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa
Metallization Materials:
Ceramic + Mo/Mn Metallized + plating Ni
Ceramic + Mo/Mn Metallized + plating Ag
Ceramic + Mo/Mn Metallized + plating Au
Ceramic + printing Ag
Application:
widely used in thick film circuits large-scale integrated circuits, hybrid ic, semiconductor packages, chip resistors, networks resistor , focusing potentiometer, power modules, power hybrid circuits and other related fields of electronic industry
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