Polyimide Solution (Copolymerized)
Product Spotlights
Low curing temperature: Drying and complete curing can be achieved at around 190°C, which reduces energy consumption as well as the temperature requirements for the equipment.
Fast curing speed: The entire curing process is completed in just about 15-20 minutes, increasing the efficiency of the production line.
Product Overview
This product is a strongly catalytic dehydration co-polyimide slurry (PI), synthesized from high-purity imported monomers and fully compliant with RoHS requirements.
Key Performance Advantages
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Ultra-Low Curing Temperature: Full curing and drying can be completed at 190°C, reducing energy consumption and lowering equipment temperature resistance requirements.
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Rapid Curing Efficiency: Complete curing process finishes in approximately 15 minutes, significantly improving production line throughput.
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Excellent Thermal Processability: Glass transition temperature (Tg) reaches 224°C; the cured film enables stable thermoplastic processing within 340–380°C, making it suitable as a high-performance, high-temperature-resistant hot-melt adhesive.
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Ultra-Low Dielectric Properties: Exhibits exceptionally low dielectric constant and dissipation factor, meeting insulation demands for high-frequency, high-speed (5G/6G) PCBs and communication devices while ensuring minimal signal transmission loss.
For detailed specifications, please refer to the Technical Data Sheet (TDS).
The standard solid content of the sample is 20%. (customizable upon request).
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