Home > Chemicals > Specialized Preparation > Polyimide Solution (Copolymerized)

Polyimide Solution (Copolymerized)

Polyimide Solution (Copolymerized) photo-1
Polyimide Solution (Copolymerized) photo-2
Polyimide Solution (Copolymerized) photo-3
Polyimide Solution (Copolymerized) photo-4
Polyimide Solution (Copolymerized) photo-5

Product Spotlights

Key advantages:
Low curing temperature: Drying and complete curing can be achieved at around 190°C, which reduces energy consumption as well as the temperature requirements for the equipment.
Fast curing speed: The entire curing process is completed in just about 15-20 minutes, increasing the efficiency of the production line.
Negotiable MOQ: 1 Kilogram (Price negotiable depending on order volume and customization)
Key Specifications
Get Latest Price
Type:
Heat Stabilizer 
Certification:
REACH
Color:
Brown
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
7 days
Type Heat Stabilizer 
Certification REACH
Color Brown
Appearance Liquid
Usage Chemical Engineering, Other
Environmental Protection Yes
Trademark Hiofer®
Origin China

Product Overview

This product is a strongly catalytic dehydration co-polyimide slurry (PI), synthesized from high-purity imported monomers and fully compliant with RoHS requirements.

Key Performance Advantages


  • Ultra-Low Curing Temperature: Full curing and drying can be completed at 190°C, reducing energy consumption and lowering equipment temperature resistance requirements.



  • Rapid Curing Efficiency: Complete curing process finishes in approximately 15 minutes, significantly improving production line throughput.



  • Excellent Thermal Processability: Glass transition temperature (Tg) reaches 224°C; the cured film enables stable thermoplastic processing within 340–380°C, making it suitable as a high-performance, high-temperature-resistant hot-melt adhesive.



  • Ultra-Low Dielectric Properties: Exhibits exceptionally low dielectric constant and dissipation factor, meeting insulation demands for high-frequency, high-speed (5G/6G) PCBs and communication devices while ensuring minimal signal transmission loss.


For detailed specifications, please refer to the Technical Data Sheet (TDS).

The standard solid content of the sample is 20%. (customizable upon request).


Product Tags: High-temperature Resistance , Fast curing Low dielectric , special hot melt adhesive

Send Inquiry to This Supplier

* Message
0/5000

Want the best price? Post an RFQ now!
Verified Business License
Business Type
Manufacturer
Year Established
2020
Factory Size
1,000-3,000 square meters
Product Certifications
ISO9001, ISO9004, ISO17799, ISO14000, ISO10441