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Help CenterHigh Flow TARFLON PC Resin Pellets for Thin-Walled Consumer Electronics Components
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Suzhou Yifuhui New Material Co., Ltd., established in 2020 and exporting to over 14 global markets including North America and Western Europe, proudly introduces our High Flow TARFLON PC Resin Pellets. Engineered specifically for demanding thin-walled consumer electronics applications, this advanced polycarbonate material delivers exceptional processing efficiency and structural integrity. With an annual export value exceeding US$10 million shipped via major ports like Shanghai and Ningbo, we guarantee reliable supply chains for your critical manufacturing needs.
Our PC resin pellets feature industry-leading flow characteristics that enable faster cycle times and intricate mold filling – essential for producing ultra-thin components under 0.8mm. The material maintains outstanding impact resistance even at reduced wall thicknesses, significantly lowering part failure rates in devices like smartphones, wearables, and laptop housings. Unlike standard PC grades, TARFLON maintains dimensional stability across temperature fluctuations from -40°C to 120°C.
Core Technical Advantages:
- Melt Flow Rate (MFR) of 35g/10min (300°C/1.2kg) ensures complete cavity filling for complex geometries
- Notched Izod impact strength ≥65 kJ/m² at 23°C prevents cracking during assembly and drop tests
- UL94 V-0 flame rating (0.8mm thickness) meets critical safety requirements without halogen additives
- Low warpage characteristics reduce post-molding correction costs by up to 30%
| Property | Test Standard | Value |
|---|---|---|
| Density | ISO 1183 | 1.20 g/cm³ |
| Tensile Strength | ISO 527 | 65 MPa |
| HDT @1.82MPa | ISO 75 | 125°C |
| Mold Shrinkage | Internal Method | 0.6-0.8% |
Manufacturers benefit from 20-25% faster injection speeds compared to conventional PC resins, directly translating to higher production output. The material's excellent thermal stability allows processing at lower barrel temperatures (280-310°C), reducing energy consumption. For surface-critical components, TARFLON PC achieves Class A finishes without flow marks – ideal for visible parts requiring metallization or painting.
Processing Recommendations:
- Pre-drying: 4 hours at 120°C (moisture content <0.02%)
- Melt temperature range: 280-310°C
- Mold temperature: 80-100°C
- Back pressure: 50-100 bar
Backed by our US$10-50 million annual export volume and shipments through Shanghai/Ningbo/Qingdao ports, we ensure material consistency across batches with comprehensive QC protocols. Serving OEMs across 6 continents, we understand regional compliance requirements for electronics materials. Our technical team provides application-specific guidance on gate design, wall thickness optimization, and mold flow analysis to maximize your production yield.
FAQ Section:
Q: What minimum wall thickness can this PC resin achieve?
A: The high-flow formulation reliably produces walls down to 0.4mm in optimized molds, though 0.6mm is typical for most consumer electronics applications.
Q: Is this material suitable for ultrasonic welding?
A: Yes, it maintains excellent weld line strength – typical joint efficiency exceeds 85% of base material strength.
Q: Can you provide halogen-free certification?
A: Halogen content is below 900ppm (Br) and 900ppm (Cl) as standard. Third-party test reports are available upon request.
Q: What packaging options are available?
A: Standard 25kg moisture-proof bags with palletization. Custom packaging including supersacks can be arranged.
Q: Do you offer color-matched compounds?
A: Yes, we provide custom color matching services with masterbatches meeting ISO 9001 standards.
Q: What's the lead time for 20-ton orders?
A: Standard lead time is 15-20 days ex-stock. Express shipment options available for urgent requirements.
With documented success in Eastern Europe and Southeast Asian electronics manufacturing hubs, our TARFLON PC resin delivers quantifiable ROI through reduced scrap rates and faster cycles. Contact our Jiangsu-based technical center today for material samples and processing guidelines tailored to your component design.
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