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Ceramic laser cutting machine
Model CW-6060J
Application fields:
Suitable for precision metal cutting, precious metal processing, aluminum substrate cutting, and laser cutting, marking, drilling, etc. of ceramic materials such as alumina, aluminum nitride, zirconia, etc., LED ceramic substrate bracket drilling and cutting, automotive&LED ceramic circuit board substrate cutting, mobile phone back board, 3C electronics and other intelligent terminal electronic products, clock gears, glasses frame precision shape cutting, earpiece sound tube drilling, and cutting of some thin metal sheets, etc
Equipment advantages
1. Support laser cutting, drilling, and marking processing
2. Can process various materials such as 304, 316L, Ni Ti, L605, Li, Mg, Al, Cu, Fe, Ceramic, etc
3. Machinable flat and curved machinery
4. Compatible with dual station configuration, visual positioning, and automatic loading and unloading
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