- ShenZhen VIP FIXPHONE Technology Co., Ltd,
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Home > Products > Pre-heating Station > LUOWEI HS3 Preheating Platform for Phone PCB Layering and IC Glue Removal
LUOWEI HS3 Preheating Platform for Phone PCB Layering and IC Glue Removal
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Product Details
| Material | Aluminium | Type | Other | |
| Certification | CCC | Usage | Other, Phone repair | |
| Brand | Other | Trademark | phonefix | |
| Origin | China |
Product Description
Luowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate provides 99W constant temperature control and a 65mm*100mm heating size for mobile phone PCB board layering, laminating, and chip glue removal. It is well-suited for various mobile phone motherboard tinning, degumming, and laminating tasks.
Features:
1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient heating coverage.
2. Three-level insulation design: helps maintain optimal temperature while minimizing heat loss, better improving energy efficiency and effective performance during maintenance.
3. Uniform heating: Providing consistent heat distribution is essential to prevent damage to sensitive components during maintenance.
4. Wide range of uses: Suitable for tasks such as motherboard layering, lamination, tinning, degumming, temperature control, etc.
5. Portable and efficient: Small size and easy to carry, strong performance and precise temperature control.
6. Simple operation: Can reflect the status of the device according to color changes.
7. Rapid heating: Maximum power 99W, no need for hot air gun soldering iron, heating evenly.
Package List:
1 x Platform.
1 x Cable.
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