Home > Electrical & Electronics > Passive Components > Capacitor > Tackling Phone Glue and Chip Removal Made Easy

Tackling Phone Glue and Chip Removal Made Easy

US$ 5 ≥1 Piece
Key Specifications
Get Latest Price
Brand Name:
PHONEFIX
Place of Origin:
China
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
3 days
Brand Name PHONEFIX
Place of Origin China
Description

YCS Tools JGB 10 in 1 multi-function handle knife brush mobile phone repair kit for mobile phone back glass glue removal, cell phone motherboard CPU disassembly, BGA chip removal, glue removal, PCB IC cleaning, etc.

Features:
1. The cross-shaped stable chuck is precisely positioned, and the anti-slip mesh design is firm and not loose.
2. Sharp and tough blades, six blades of precision quality ensure durable use.

Product Parameters:
Name: YCS Tools - JGB 10 In 1 Blade Kit
Packaging size: 132x82x15mm
Contents of the set: handle x2, blade x6, brush x2
Product weight: about 60g
Scope of application: back cover glass glue removal, motherboard CPU delamination, chip disassembly, circuit cutting, etc. Mobile phone repair purposes.


Product Tags: adhesiveremoval , mobilephonefix , circuitboardrepair

Send Inquiry to This Supplier

* Message
0/5000

Want the best price? Post an RFQ now!
Verified Business License
Business Type
Manufacturer
Year Established
2017
Port of Shipment
Shenzhen , hongkong
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market

Recommended Categories

Explore top categories and find suppliers for your specific needs