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Help CenterSMT Patch Adhesive Does Not Peel Off, Dispensing Red Adhesive Patch Processing, High-speed Dispensing, High-temperature Resistant Dispensing Red Adhesive
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1. Product Introduction
TDC04x is an adhesive (commonly known as red glue) used to fix SMD electronic components on PCBs. It is a heat cured single component epoxy resin system with good high-speed dispensing performance, rapid heating curing, strong adhesion, resistance to repeated thermal shock of soft solder at high temperatures, and long shelf life. The dispensing head of the dispensing device can be used normally without temperature control function.
2. Product Features
Good dispensing performance: used in a wide range of environmental temperatures, suitable for high, medium, and low speed dispensing machines, with a maximum dispensing speed of 36000 points per hour, and no wire drawing or edge collapse for both large and small amounts of glue. The shape of the glue points is consistent. The lower air pressure required for dispensing can improve production efficiency and reduce energy consumption.
B Heating and rapid curing: The curing speed is fast at medium temperature, protecting thermal sensitive components and improving the efficiency of PCB passing through the furnace.
Strong adhesive strength: TDC04x enables various SMD chip components to achieve stable and high adhesive strength, reducing dropout rates while saving raw material and labor costs.
D High temperature resistant solder thermal shock: After solidification, electronic components can undergo multiple high-temperature operations such as wave soldering and soldering furnaces to keep the components fixed on the PCB, with extremely low drop rate and reduced component loss during the production process.
Long shelf life: TDC04x red glue has a shelf life of 48 hours at a production environment temperature of 22 ℃ -28 ℃, and a normal shelf life of 8 months when stored in an environment below 6 ℃. Can adapt to a large number of uninterrupted production operations.
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