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G-Lon Middle Layers BGA Reballing Stencil Set for IPhone X-XS MAX

G-Lon Middle Layers BGA Reballing Stencil Set for IPhone X-XS MAX photo-1
G-Lon Middle Layers BGA Reballing Stencil Set for IPhone X-XS MAX photo-2
US$ 16 - 17 MOQ: 1 Piece
Key Specifications
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Brand Name:
phonefix
Place of Origin:
China
Model Number:
FIX357
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
7 days
Brand Name phonefix
Place of Origin China
Model Number FIX357
Type Machine Tools

G-LON SS-032 Middle Board BGA Reballing Fixture with Special Solder Paste for iPhone X / Xs / Xs Max

Features :

  1. This set of tools breaks through the problem of low success rate of traditional mainboard repairing.

  2. Greatly reduced the difficulty of iPhone X motherboard maintenance.

  3. The mystery lies in the professionalism of the soldering paste. There is no difference between this product and the original middle layer tin.

  4. The tin melting point of the CPU area is slightly lower than that of the surrounding area.
    This solder paste uses the principle of temperature difference, easily blow CPU without touching the peripheral accessories.

  5. Within the fine temperature difference. Makes the entire maintenance efficiency greatly improved.

  6. Even green hands can plant tin perfectly.


Specification :

  • Item name: G-Lon BGA Reballing Fixture

  • Material: Synthetic stone

  • Color: As pictures shown

  • Quantity: 5pcs

  • Weight: 0.6kg

  • Applicable models: iPhone X / XS / XS Max


Package includes:

  • 1pc x Fixture

  • 1pc x Special Solder Paste

  • 3pcs x Stencil Net


Product Tags: BGA Reballing Platform , phonefix

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Verified Business License
Year Established
2017
Port of Shipment
shenzhen
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market
Location
Shenzhen, Guangdong, China