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Help CenterJSW 615 Hot Melt Adhesive Film Circuit Board Flame Retardant Hot Melt Adhesive Film Hardware Hot Melt Adhesive Film
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Typical used in assembly bonding, product structure bonding, JSW615 hot melt adhesive because of the room temperature is not sticky, can strip the release paper die-cutting processing, bending processing. And JSW's R&D personnel can develop application solutions according to the specific requirements of the customer's product structure. JSW615 hot melt adhesive development and production, to provide customers with the most perfect solution and strong technical support. The more obvious the cost advantage, the most important thing is that JSW615 hot melt adhesive is strong, will not degumming, bonding metal, plastic firm, reliable. Thickness :0.085MM, adhesion N/2CM:275N/4CM, release paper :0.11MM. JSW615 hot melt adhesive high and low temperature resistance is reliable, the industry general high and low temperature test is no problem. Modified solid JSW615 hot melt adhesive is a kind of cross-linked adhesive with high bonding strength, which has the characteristics of fast melting by heating and high strength bonding force by curing. It can meet the bonding requirements of product structural components.
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