Diamond Dicing Blade for motherboard grooving

Bond:

Resin or Metal

Application:

Glass (optical   devices, fiber optics), quartz (optical splitters, saw devices), LiTa03   LiNb03 (devices), QFN （copper epoxy molding ), splitter,   sapphire

Specification:

Customized

Brand Mark:

Moresuperhard

Trade Terms:

FOB

Packages:

Hard carton

Delivery Time:

15 workdays by   express

4” /100

0.5, 0.6, 0.8,   1.0, 1.2, 1.5

0.4, 0.5, 0.6,   0.8, 1.0, 1.3.

20, 31.75

5, 10

5”/ 125

0.5, 0.6, 0.8,   1.0, 1.2, 1.5

0.4, 0.5, 0.6,   0.8, 1.0, 1.3

20, 31.75

5, 10

6”/ 150

0.6, 0.8, 1.0,   1.2, 1.5, 1.8

0.5, 0.6, 0.8,   1.0, 1.3, 1.6

20, 31.75

5, 7, 10

8”/ 200

 0.8,   1.0, 1.2, 1.5, 1.8

0.6, 0.7, 0.8,   0.9, 1.1, 1.2, 1.4, 1.5.

20, 31.75

5, 7, 10

12”/ 300

1.0, 1.2, 1.4,   1.5, 1.7, 1.8

0.7, 0.9, 1.1,   1.4

20, 31.75

5, 7, 10

16”/ 400

1.2, 1.5, 1.7,   1.8, 1.9, 2.0, 2.3

0.9, 1.2, 1.4,   1.6, 2.0

20, 31.75

5, 7, 10

20”/ 500

1.2, 1.5, 1.7,   1.8, 1.9, 2.0, 2.3

0.9, 1.2, 1.4,   1.6, 2.0

20, 31.75

5, 7, 10

Other size can   be made according to customers’ requirement