MIJING Z20 Pro middle layer reballing platform

MJ Z20 Pro Phone motherboard middle layer frame tin planting platform with stencil steel mesh for Phone X-14 Pro Max motherboard soldering repair. 

Product Features:

Phone X-14 PRO MAX BGA reballing fixture tool.

Used for positioning and reballing Phone X-14 Pro Max PCB BGA parts.

Convenient and faster for reballing BGA without any damage.

Offer you best solution for Phone X-14 Pro Max BGA reballing and repairing.

How to install:

Install the Phone X-14 Pro Max main board on the platform

Cover the Phone X-14 Pro Max BGA reballing stencil on mainboard

Evenly spread tin on the cover of the reballing stencil

Remove the reballing stencil cover

Take out the motherboard and cooperate with the hot air gun to solidify the tin point.