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Home > Electrical & Electronics > Power Transmission & Transformer > Transformer > MIJING Z20 Pro Middle Layer Reballing Platform
US$ 26.95 - 26.99
MOQ: 1 Piece
Key Specifications
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Brand Name:
MIJING
Place of Origin:
China
Model Number:
Z20PRO
Payment & Shipping
Payment Methods:
Port of Shipment:
Hongkang Shenzhen
Delivery Detail:
3 days
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Brand Name
MIJING
Place of Origin
China
Model Number
Z20PRO
MJ Z20 Pro Phone motherboard middle layer frame tin planting platform with stencil steel mesh for Phone X-14 Pro Max motherboard soldering repair.
Product Features:
Phone X-14 PRO MAX BGA reballing fixture tool.
Used for positioning and reballing Phone X-14 Pro Max PCB BGA parts.
Convenient and faster for reballing BGA without any damage.
Offer you best solution for Phone X-14 Pro Max BGA reballing and repairing.
How to install:
Install the Phone X-14 Pro Max main board on the platform
Cover the Phone X-14 Pro Max BGA reballing stencil on mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
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Business Type
Manufacturer
Year Established
2017
Port of Shipment
Shenzhen , hongkong
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market
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