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Diamond lapping pad for mobile phone glass
Diamond lapping pad is a consolidated diamond lapping tool with special structure. It is prepared by uniformly dispersing diamond powder in organic resin adhesive. It is suitable for processing a variety of hard and brittle materials such as glass, ceramics and semiconductor substrates.
Characteristics:
(1) The diamond powder with independent property right of our company is adopted, which has round shape and small cutting edge, so it is not easy to cause deep scratches to the processed workpieces.
(2) The advanced technology can produce regular three-dimensional structure. The multi-layer polishing particles in the three-dimensional structure are evenly distributed, which can fall off layer by layer during the lapping process, and maintain excellent "self-sharpening", and the processing efficiency is high and stable, which can greatly shorten the processing time.
(3) Matching with the coolant, there is no need to add additional polishing slurry, and the production environment is clean.
(4) Compatible with the mainstream single-sided and double-sided polishing equipment in the market.
Specification:
Dimension |
Outer diameter: 200mm-1220mm |
||
Size |
20 micron |
9 micron |
4 micron |
Remarks: Special requirements can be tailor-made.
Precautions before use:
(1) Cleaning the equipment and disk surface to ensure the adhesion of the back glue of the lapping pad
(2) During the circulation of the coolant, increasing filtration to avoid scratches caused by pollution.
Main applications:
For hard and brittle materials such as soda lime glass, aluminosilicate glass, lithium niobate, quartz, glass-ceramic cover plate, sapphire, zirconia ceramics, etc. The appropriate specification can be selected according to the hardness of specific materials and processing requirements.
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