S1016 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set

Mechanic S1016 BGA Repair Ultra thin blade set, can be used for remove IC Chip CPU BGA on Smart Phone mainboard, PCB Repair, operate convenient, Mechanic CPU BGA Chip Remove Tool glue knife disassembly cleaning tool  ( 1pcs handle + 16pcs Blades ), with the scale on Blades.

Mechanic S1016 Plus BGA Repair Ultra thin blade set for phone Motherboard Repair

Mechanic S1016 BGA Repair Ultra thin blade set used for remove IC Chip CPU BGA on Smart Phone mainboard, PCB Repair, operate convenient

Package list: 
#0 T S016 handle
#MCN-A Knifes,  remove phone IC, CPU Baseband
#MCN-B Knifes,  Shovel Glue ( Remove UV glue)
#MCN-C,  Rubber Shovel UV Glue Knife
#MCN-D,  separate rubber shovel Glue Knife
#MCN-E,  Remove Glue on Marginal place
#MCN-F,  Remove Glue on Marginal place (IC)
#MCN-G,  Remove IC on motherboard
#MCN-H,  Remove IC
#MCN-I,  Remove 6S power IC

added:　#MCN-J,  "J" Curved Blade ( Cutting Knife ), pry BGA CPU CHIP, Fast Remove A8 A9 A10 CPU 

added: "Z Y X W V T" 6 kinds Blade.

16pcs Blades + 1pcs: Dual-purpose knife handle

Mechanic S1016 Plus BGA Repair Blade Set

This Blade has a heat resistance, low templeratures, anti-oxidation, corrosion, resistance, abrasion resistance, toughness.

Blade Features:
Heat treatment specifications:
Sample quenching: 780-820℃, Water-cooled.
Heat processing specification:
Starting temperatures: 1000-1050℃, ending remperature 850℃

Quenching specification:
Quenching temperature: 730-760℃
Quenching hardness 58HRC