iRepair MS1 Soldering heating Station For phone X-13Promax PCB Disassembly Tool

Mijing iRepair MS1 desoldering preheating platform For Phone X-14 Pro Max motherboard CPU IC heating disassembly and glue removal. iRepair MS1 Soldering heating Staion MS1-14 module for Phone 14/14 Plus/14 Pro/14 Pro Max. 

Feature:
1.  iRepair MS1 pre-heating staion for Phone X/XS/XS MAX/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max motherboard soldering separating. 
2. Mijing iRepair MS1 Multi-function Desoldering Station
3. Newly upgraded heating element, fast heating, precise temperature control
4. Added countdown function, layering and fitting are more secure
5. Phone X -14 Pro Max module + universal module + dot matrix module + follow-up unlimited upgrades.
6. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.

Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station
Packing size: 220*158*50 (mm)
MS1 upgrade expansion module
Packing size: 114*79*10 (mm)