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Help CenterVitrified Bond Cylindrical Diamond Grinding Wheel for HVOF Tungsten Carbide Coating
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Vitrified bond Cylindrical Diamond Grinding Wheel for HVOF Tungsten Carbide Coating
Description of the Vitrified bond Cylindrical Diamond Grinding Wheel for HVOF Tungsten Carbide Coating:
Resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materals.
Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.
Feature/Benefit of the Vitrified bond Cylindrical Diamond Grinding Wheel for HVOF Tungsten Carbide Coating
1. Good free-cutting
2. Good Abrasion Resistance
3. Availability in a broad range of applications in both Dry and Wet Condition
Application of the Vitrified bond Cylindrical Diamond Grinding Wheel for HVOF Tungsten Carbide Coating
1. Surface grinder,
2. PCD/PCBN tools grinding,
3. Tungsten carbide grinding,
4. Glass grinding
5. Stone grinding
Specification of resin diamond grinding wheel:
Type: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc.
Diameters: 25mm-1000mm
Thickness: 5mm-250m
Grit: 50# -2000#
Hole: according to the customer requirement
Concentration: 150,175,200
to meet your requirements in every way, we need the following information
----- Shape and Dimension of the wheels
----- Grit size (Mesh, refer to Table#1)
----- Concentration
----- Bond(Resinoid, Vitrified, Metallic, Electroplated)
----- Quantity
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