Diamond Wire for Solar Wafers
-Diameter online measuring
-Metallographic microscope measuring
-Diameter measuring
-High power microscope measuring
Electroplated Diamond Wire
Advanced Plating Diamond Wire Production Process
Wire Preparation → Oil Removal → Acid Treatment → Washing → Sand Embedding → Sand Consolidation → Wire Collection
All-Around Quality Control Of Diamond Wire
-Diameter online measuring
-Metallographic microscope measuring
-Diameter measuring
-High power microscope measuring
-SEM measuring
Diamond Wire For Cutting Solar Wafers
PRODUCTS |
DESCRIPTION |
APPLICATION |
|
DW-80 |
Bus/Germ Line |
Φ65 Um |
|
Diamond Particles |
8-10 Um |
||
Tensile Force |
4000 |
Cutting Solar Wafers |
|
Breaking Force |
≥17N |
||
The Diameter Of |
Φ80 Um |
||
DW-85 |
Bus/Germ Line |
Φ70 Um |
|
Diamond Particles |
8-10 Um |
||
Tensile Force |
4000 |
||
Breaking Force |
≥19N |
Cutting Solar Wafers |
|
The Diameter Of |
Φ85 Um |
||
DW-95 |
Bus/Germ Line |
Φ80 Um |
|
Diamond Particles |
8-10 Um |
||
Tensile Force |
4000 |
||
Breaking Force |
≥21N |
Cutting Solar Wafers |
|
The Diameter Of |
Φ95 Um |
||
|
DW-110 |
Bus/Germ Line |
Φ85 Um |
|
Diamond Particles |
8-13 Um |
||
Tensile Force |
4000 |
||
Breaking Force |
≥25N |
Cutting Solar Wafers |
|
The Diameter Of |
Φ110 Um |
||
Packing & Delivery
Contact
Tel: 0086-136-33852636
Email: caec.sara@gmail.com
Sales Manager: Sara Wang
Henan Si&C Co., Ltd
Send Inquiry to This Supplier
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