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High precision dicing
Improved cut quality on hard materials
Superior cut quality
Good wear resistance
PRODUCT DETAILS
Description:
Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed.
Application:
Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN （copper epoxy molding ), splitter, sapphire.
Advantages:
1.High precision dicing
2.Improved cut quality on hard materials
3.Superior cut quality
4.Good wear resistance
DRAWING&SPECIFICATION
Inner Diameter |
Outer Diameter |
Thickness |
||
inches |
mm |
inches |
mm |
mm |
1’’ |
25.4 |
2’’ |
50.8 |
0.07-2.00 |
1.5’’ |
38.1 |
2.25’’ |
57.1 |
|
1.575’’ |
40 |
2’’-3’’ |
50.8-76.2 |
|
|
2.75’’
|
69.8 |
4.4’’ |
101.6 |
|
4.5’’ |
114.3 |
|||
3’’ |
76.2 |
4.4’’ |
101.6 |
|
4.5’’ |
114.3 |
|||
5’’ |
127 |
|||
3.497’’ |
88.82 |
4.256’’ |
108.1 |
|
4.6’’ |
116.8 |
|||
4.7’’ |
119.4 |
|||
5’’ |
127 |
|||
3.5’’ |
88.9 |
4.256’’ |
108.1 |
|
4.6’’ |
116.8 |
|||
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