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Home > Tools & Hardware > Abrasive & Grinding > Grinding Wheel > 6 Inch DIE SAW Processing Wafer Frame Cassette
Negotiable
MOQ: 1 Unit (Price negotiable depending on order volume and customization)
Key Specifications
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Model Number:
DSF20K06-000-R0
Size:
215mm*212mm*146mm
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
Delivery time depends on order quantity.
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Model Number
DSF20K06-000-R0
Size
215mm*212mm*146mm
DIE SAW processing technology is to cut and slice a complete wafer into a grain of grain, which is convenient for the next process. In the process of cutting the dicing, a carrier must be provided to carry out the storage of the cut wafer. The 6 inch DIE SAW processing wafer cassette can do this daunting task well.
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Business Type
Manufacturer
Year Established
2008
Annual Export Value
US$2.5 Million - US$5 Million
Port of Shipment
shenzhen
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