PCB Board Assembly Mass Production and Prototype PCBA with High Quality

PCBA capabilities:
•SMT assembly including BGA assembly
•Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
•Component height: 0.2-25mm
•Min packing: 0201
•Min distance among BGA : 0.25-2.0mm
•Min BGA size: 0.1-0.63mm
•Min QFP Space: 0.35mm
•Min assembly size: (X*Y): 50*30mm
•Max assembly size: (X*Y): 350*550mm
•Pick-placement precision: ±0.01mm
•Placement capability: 0805, 0603, 0402, 0201
•High pin count press fit available
•SMT capacity per day: 800,000 point
 
DIP capability:
•A-8 of semi-assembly work line with 3 set wave soldering machines
•B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
•All products are 100% inspected and tested during the DIP process
 
Advantages:
•Strict product liability, taking IPC-A-160 standard
•Engineering pretreatment before production
•Production process control (5Ms)
•100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•100% AOI inspection, including X-ray, 3D microscope, ICT
•High-voltage test, impedance control test
•Micro section, soldering capacity, thermal stress test, shocking test
•In-house PCB production
•No minimum order quantity and free sample
•Focus on low to medium volume production
•Quick and on-time delivery
 
We have high-qualified management team, experienced R and D team and skilled employees and possess advantaged supply chain, commitment to quality and dedication to our customer's service
 
Welcome to send us gerber file and BOM list for estimating at any time
You will get our prompt reply in 24H